Plating Chemicals detail

Sn-Bi alloy plating

Middle- and high-speed, barrel and rack matte plating process	PF-05M	For use with middle- and high-speed matte plating processes. Provides particularly excellent anti-corrosion, solderability and whisker prevention. Can be used with a wide usable current density range.
Middle- and high-speed matte plating process	PF-05SH	For use with middle- and high-speed matte plating processes. Provides particularly excellent anti-corrosion, solderability and whisker prevention.
Barrel bright plating process	BTB-001	For use with barrel and rack bright plating processes. Provides particularly excellent solderability and whisker prevention.
Middle- and high-speed, and rack bright plating process	HTB-005	For use with middle- and high-speed bright plating processes. Provides particularly excellent solderability and whisker prevention.

Middle- and high-speed matte plating process	PF-098S	For use with middle- and high-speed matte plating processes. Provides particularly excellent solderability and whisker prevention. Has tolerance for impurities and shows excellent stability.
Middle- and high-speed matte plating process	PF-077S	For use with middle- and high-speed matte plating processes. Provides particularly excellent solderability, and whisker prevention. Also shows excellent reflow appearance.
Barrel and rack matte plating process	PF-055S	For use with barrel and rack matte plating processes. Provides particularly excellent anti-corrosion, solderability. Has tolerance for impurities and shows excellent stability.
Middle- and high-speed bright plating process	PF-081S	For use with reel-to-reel and wire bright plating processes. Provides particularly excellent anti-corrosion and solderability. Can be used with a wide usable current density range and shows excellent stability.
Barrel and rack bright plating process	T-020	For use with barrel and rack sulfuric acid bright plating processes. Provides particularly excellent anti-corrosion, solderability, and consistency of appearance.

*Resistance to heat discoloration can be improved by using our 501SN discoloration prevention chemical as a post-treatment agent.

Middle- and high-speed matte plating process	MTS-554	For use with middle- and high-speed matte plating processes. Provides particularly excellent anti-corrosion, solderability, and stability.
Barrel -matte plating process	BTS-004	For use with barrel and rack -matte plating processes. Provides particularly excellent anti-corrosion, solderability, and stability.

Middle- and high-speed matte plating process	HTC-603	For use with middle- and high-speed matte plating processes. Provides particularly excellent anti-corrosion and solderability.
Barrel and rack matte plating process	HTC-516	For use with barrel and rack matte plating processes. Provides particularly excellent solderability.
Middle- and high-speed bright plating process	HTC-528	For use with middle- and high-speed bright plating processes. Provides particularly excellent anti-corrosion and solderability. Has tolerance for impurities and shows excellent stability.
Barrel and rack bright plating process	BTC-100	For use with barrel and rack bright plating processes. Provides particularly excellent anti-corrosion and solderability. Can be used with a wide usable current density range and shows excellent stability.

Barrel matte plating process	NB-ZZ	Can be operated at wide control range and simple bath control. Provides particularly excellent anti-corrosion and solderability. Recommend for use with chip components such as resistors that require high-speed performance.
	NB-RZ	Shows less attack on ceramic-based dielectric areas of the component and excellent macrothrowing power.
	NB-RZS	Shows less attack on ceramic-based dielectric areas of the components. Low-foaming character is suitable for high speed rotate systems.

Sn-Ag alloy plating	UTB TS-140	Lead-free bath.
Sn-Ag alloy plating	UTB TS-202	Lead-free bath for high-speed plating.
Sn-Pb alloy plating	UTB MX-M03069-574A1	Eutectic plating type
Sn-Pb alloy plating	UTB MX-M06005-571D0	High-melting-point plating type

Electroless Sn plating for COFs	580M-Z Series	Non-fluoride formulation. Has less irregular depositions such as dendrite and frills.
Electroless Sn plating for thick applications	580M-J Series	Immersion-type formulation. Provides uniformed surface and heavier deposits, approximately 3 μm thickness.
Electroless Pd plating for printed circuit boards	APP process	Phosphorus type. Provides excellent adherence and a uniform appearance.
Electroless Pd plating for printed circuit boards	LP process	Low-phosphorus type. Provides excellent solderability and contact resistance.

W-10 process

For rewiring use. Provides low stress and a uniform bright appearance.

For jig and belt	SPF-02	Dipping type. Stripping chemical for use with tin and tin alloy (Sn-Bi) finishes.
For jig and belt	SPF-171	Electrolysis type. Stripping chemical for use with tin and tin alloy (Sn-Bi) finishes.
For stripping lead-free products (for reuse)	SPF-11	Undiluted use. Stripping chemical for use with tin and tin alloy (Sn-Bi, etc.) plating on a Fe-Ni alloy substrate.
For stripping lead-free products (for reuse)	SPF-21	Undiluted use. Stripping chemical for use with tin and tin alloy (Sn-Bi, etc.) plating on a copper alloy substrate.
For stripping lead-free products (for reuse)	STRIP SOLDER-M	Features extremely low sludge production and a long life time.
	STRIP SOLDER-C	Nitric acid formulation delivers fast stripping at low cost.
	STRIP SOLDER-A	Alkaline formulation is designed for use with Fe-Ni alloy and steel substrates.
	STRIP SOLDER-S	Weak acidic undiluted-use formulation is designed for use with copper alloy substrates.

501SN

Provides excellent protection against discoloration after heat treatment.

Au-111B

Dipping type. Provides excellent stability in a water-soluble formulation.

SB、FL、512K

Flocculant to remove turbidity, Sn(4+) sludge, from plating solution.

NS Series

Fine Steel ball coated Tin plating on Ni finish. Available in variety range of diameters.