Analytical equipment by industry and model
Printed Wiring Boards (TAB/COF)
Analytical equipment for use with wet processes in printed wiring board and TAB/COF manufacturing
| Process | Model | Managed components | Catalog no. |
|---|---|---|---|
| Development | Na2CO3 | pH, sodium carbonate, resist | M-01 |
| K2CO3 | pH, potassium carbonate | M-02 | |
| Soft etching | Na2S2O8 , H2SO4 , Cu | Sodium persulfate, sulfuric acid, copper | M-08 |
| H2O2 , H2SO4 , Cu | Hydrogen peroxide, sulfuric acid, copper | M-07 | |
| Etching | CuCl2 | Hydrochloric acid, cupric chloride | M-16 |
| Stripping | NaOH | Sodium hydroxide | M-05 |
| Desmear | NaMnO4 , NaOH | Sodium permanganate, sodium hydroxide | M-19 |
| Catalyst | Pd | Palladium | M-26 |
| DMAB | Dimethylamine-borane | M-15 | |
| Electroless copper plating | NaOH , HCHO , Cu | Sodium hydroxide, formalin, copper | M-21 |
| Electrolytic copper plating (copper sulfate bath) | H2SO4 , Cu , Cl | Sulfuric acid, copper , Chlorine | M-29 |
| Fe3+ | Trivalent iron | M-17 | |
| Black oxide | NaClO2 , NaOH | Sodium chlorite, sodium hydroxide | M-12 |
| K2S2O8 , NaOH | Potassium persulfate, sodium hydroxide | M-20 | |
| Electroless nickel plating | Ni , NaH2PO2 | pH, nickel , NaH2PO2 | M-13 |
| Ni | pH, nickel | M-22 | |
| DMAB | Dimethylamine-borane | M-15 |
Plastic Plating Market
Analytical equipment for use with a variety of plastic plating wet processes
| Process | Model | Managed components | Catalog no. |
|---|---|---|---|
| Degreasing | NaOH | Sodium hydroxide | M-30 |
| Catalyst | Pd | Palladium, chromium | M-25 |
| Electroless nickel plating | Ni , NaH2PO2 | pH, nickel , NaH2PO2 | M-13 |
| Electrolytic copper plating (copper sulfate bath) | H2SO4 , Cu , Cl | Sulfuric acid, copper , Chlorine | M-29 |
| Electro-nickel plating (Watts bath) | Ni , Cl , H3BO3 | Nickel sulfate, nickel chloride | M-23 |
| Conductive processing | Cu | Copper | M-28 |
Flat-panel Display Market
Analytical equipment for use with wet processes in printed wiring board and TAB/COF manufacturing
| Process | Model | Managed components | Catalog no. |
|---|---|---|---|
| Cleaning | TMAH | Tetramethylammonium hydroxide | M-03 |
| NaOH | Sodium hydroxide | M-30 | |
| KOH | Potassium hydroxide | M-06 | |
| Development | Na2CO3 | pH, sodium carbonate | M-01 |
| TMAH | Tetramethylammonium hydroxide | M-03 | |
| NaOH | Sodium hydroxide | M-30 | |
| KOH | Potassium hydroxide | M-06 | |
| MEA | Monoethanolamine | M-04 | |
| TEA | Triethanolamine | M-18 | |
| Etching | Ce , HNO3 | Ceric nitrate, nitric acid | M-11 |
| C2H2O4 | Oxalic acid | M-09 | |
| H3PO4 , HNO3 , C2H4O2 | Phosphoric acid, nitric acid, acetic acid | M-10 | |
| Stripping | Na2CO3 | pH, sodium carbonate | M-01 |
| NaOH | Sodium hydroxide | M-30 | |
| KOH | Potassium hydroxide | M-06 | |
| MEA | Monoethanolamine | M-04 |
Plating Processing Market
Analytical equipment for use with electroless, electroplating wet processes
| Process | Model | Managed components | Catalog no. |
|---|---|---|---|
| Electrolytic degreasing | NaOH | Sodium hydroxide | M-05 |
| Electroless copper plating | NaOH , HCHO , Cu | Sodium hydroxide, formalin, copper | M-21 |
| Electroless nickel plating | Ni , NaH2PO2 | pH, nickel , NaH2PO2 | M-13 |
| Electro-nickel plating (sulfamic acid bath) | Ni , Cl , H3BO3 | Nickel sulfamate, nickel chloride, pH, Boric acid | M-24 |
| Electro-nickel plating (Watts bath) | Ni , Cl , H3BO3 | Nickel sulfate, nickel chloride , pH, boric acid | M-23 |
| Electro-copper plating (copper sulfate bath) | H2SO4 , Cu , Cl | Sulfuric acid, copper , Chlorine | M-29 |
| Fe3+ | Trivalent iron | M-17 | |
| Zinc plating (zincate bath) | Zn, NaOH | Zinc, sodium hydroxide | M-14 |
| Electro-alloy plating (black Ni-Zn) | Zn | Zinc | M-14 |
| Ni | pH, nickel | M-22 | |
| Electroless-palladium plating | Pd | Palladium | M-31 |
| Electroless-gold plating | Au | pH, gold | M-27 |
| Electro-gold plating | Au | pH, gold | M-27 |