ISHIHARA CHEMICAL CO.,LTD

Middle- and high-speed, barrel and rack matte plating process
PF-05M	For use with middle- and high-speed matte plating processes. Provides particularly excellent anti-corrosion, solderability and whisker prevention. Can be used with a wide usable current density range.
Middle- and high-speed matte plating process
PF-05SH	For use with middle- and high-speed matte plating processes. Provides particularly excellent anti-corrosion, solderability and whisker prevention.
Barrel bright plating process
BTB-001	For use with barrel and rack bright plating processes. Provides particularly excellent solderability and whisker prevention.
Middle- and high-speed, and rack bright plating process
HTB-005	For use with middle- and high-speed bright plating processes. Provides particularly excellent solderability and whisker prevention.

Middle- and high-speed matte plating process
PF-098S	For use with middle- and high-speed matte plating processes. Provides particularly excellent solderability and whisker prevention. Has tolerance for impurities and shows excellent stability.
PF-077S	For use with middle- and high-speed matte plating processes. Provides particularly excellent solderability, and whisker prevention. Also shows excellent reflow appearance.
Barrel and rack matte plating process
PF-055S	For use with barrel and rack matte plating processes. Provides particularly excellent anti-corrosion, solderability. Has tolerance for impurities and shows excellent stability.
Middle- and high-speed bright plating process
PF-081S	For use with reel-to-reel and wire bright plating processes. Provides particularly excellent anti-corrosion and solderability. Can be used with a wide usable current density range and shows excellent stability.
Barrel and rack bright plating process
T-020	For use with barrel and rack sulfuric acid bright plating processes. Provides particularly excellent anti-corrosion, solderability, and consistency of appearance.

*Resistance to heat discoloration can be improved by using our 501SN discoloration prevention chemical as a post-treatment agent.

Middle- and high-speed matte plating process
MTS-554	For use with middle- and high-speed matte plating processes. Provides particularly excellent anti-corrosion, solderability, and stability.
Barrel -matte plating process
BTS-004	For use with barrel and rack -matte plating processes. Provides particularly excellent anti-corrosion, solderability, and stability.

Middle- and high-speed matte plating process
HTC-603	For use with middle- and high-speed matte plating processes. Provides particularly excellent anti-corrosion and solderability.
Barrel and rack matte plating process
HTC-516	For use with barrel and rack matte plating processes. Provides particularly excellent solderability.
Middle- and high-speed bright plating process
HTC-528	For use with middle- and high-speed bright plating processes. Provides particularly excellent anti-corrosion and solderability. Has tolerance for impurities and shows excellent stability.
Barrel and rack bright plating process
BTC-100	For use with barrel and rack bright plating processes. Provides particularly excellent anti-corrosion and solderability. Can be used with a wide usable current density range and shows excellent stability.

Barrel matte plating process
NB-ZZ	Can be operated at wide control range and simple bath control. Provides particularly excellent anti-corrosion and solderability. Recommend for use with chip components such as resistors that require high-speed performance.
NB-RZ	Shows less attack on ceramic-based dielectric areas of the component and excellent macrothrowing power.
NB-RZS	Shows less attack on ceramic-based dielectric areas of the components. Low-foaming character is suitable for high speed rotate systems.

UTB TS-140	Lead-free bath.
UTB TS-202	Lead-free bath for high-speed plating.

UTB MX-M03069-574A1	Eutectic plating type
UTB MX-M06005-571D0	High-melting-point plating type

580M-Z Series

Non-fluoride formulation. Has less irregular depositions such as dendrite and frills.

580M-J Series

Immersion-type formulation. Provides uniformed surface and heavier deposits, approximately 3 μm thickness.

APP process	Phosphorus type. Provides excellent adherence and a uniform appearance.
LP process	Low-phosphorus type. Provides excellent solderability and contact resistance.

For rewiring use. Provides low stress and a uniform bright appearance.

<For jig and belt >
SPF-02	Dipping type. Stripping chemical for use with tin and tin alloy (Sn-Bi) finishes.
SPF-171	Electrolysis type. Stripping chemical for use with tin and tin alloy (Sn-Bi) finishes.
<For stripping lead-free products (for reuse)>
SPF-11	Undiluted use. Stripping chemical for use with tin and tin alloy (Sn-Bi, etc.) plating on a Fe-Ni alloy substrate.
SPF-21	Undiluted use. Stripping chemical for use with tin and tin alloy (Sn-Bi, etc.) plating on a copper alloy substrate.
For stripping Sn and solder products (for reuse)
STRIP SOLDER-M	Features extremely low sludge production and a long life time.
STRIP SOLDER-C	Nitric acid formulation delivers fast stripping at low cost.
STRIP SOLDER-A	Alkaline formulation is designed for use with Fe-Ni alloy and steel substrates.
STRIP SOLDER-S	Weak acidic undiluted-use formulation is designed for use with copper alloy substrates.

501SN

Provides excellent protection against discoloration after heat treatment.

Au-111B

Dipping type. Provides excellent stability in a water-soluble formulation.

SB、FL、512K

Flocculant to remove turbidity, Sn(4+) sludge, from plating solution.

NS Series

Fine Steel ball coated Tin plating on Ni finish. Available in variety range of diameters.