- Ishihara Chemical offers equipment that can accommodate a variety of solutions in addition to those listed below.
- Analytical techniques and equipment configurations may vary with solution concentration and composition.
- By moving beyond analytical management to concentration management, including solution dosing, these equipment helps maintain consistent quality while lowering production costs.
- This equipment can accommodate a variety of sophisticated customer dosing for electronic component production processes, which are characterized by a move toward increasingly advanced functionality and high added value.
Printed Wiring Boards (TAB/COF)
| Process | Model | Managed components | Catalog no. |
|---|---|---|---|
| Development | Na2CO3 | pH, sodium carbonate, resist | A-01 |
| K2CO3 | pH, potassium carbonate | A-02 | |
| Soft etching | Na2S2O8 , H2SO4 , Cu | Sodium persulfate, sulfuric acid, copper | A-09 |
| H2O2 , H2SO4 , Cu | Hydrogen peroxide, sulfuric acid, copper | A-07 | |
| Etching | CuCl2 | Hydrochloric acid, cupric chloride | A-19 |
| Stripping | NaOH | Sodium hydroxide | A-05 |
| Desmear | NaMnO4 , NaOH | Sodium permanganate, sodium hydroxide | A-24 |
| Catalyst | Pd | Palladium | P-06 |
| DMAB | Dimethylamine-borane | A-17 | |
| Electroless copper plating | NaOH , HCHO , Cu | Sodium hydroxide, formalin, copper | P-01 |
| Electrolytic copper plating (copper sulfate bath) | H2SO4 , Cu | Sulfuric acid, copper | P-04 |
| Cl | Chlorine | P-05 | |
| Fe3+ | Trivalent iron | A-21 | |
| Black oxide | NaClO2 , NaOH | Sodium chlorite, sodium hydroxide | A-14 |
| K2S2O8 , NaOH | Potassium persulfate, sodium hydroxide | A-26 | |
| Electroless nickel plating | Ni | pH, nickel | P-02 |
| DMAB | Dimethylamine-borane | A-17 |
Plastic Plating Market
| Process | Model | Managed components | Catalog no. |
|---|---|---|---|
| Degreasing | NaOH | Sodium hydroxide | A-05 |
| Etching | Cr , H2SO4 | Trivalent chromic acid, hexavalent chromic acid, sulfuric acid | A-25 |
| Catalyst | Pd | Palladium, chromium | P-06 |
| Electroless nickel plating | Ni | pH, nickel | P-02 |
| NaH2PO2 | Sodium hypophosphite |
A-15 | |
| Electrolytic copper plating (copper sulfate bath) | H2SO4 , Cu | Sulfuric acid, copper | P-04 |
| Cl | Chlorine | P-05 | |
| Acid activation | (NH4)2S2O8 , H2SO4 , Cu | Ammonium persulfate, sulfuric acid, copper | A-09 |
| Electro-nickel plating (Watts bath) | Ni , Cl | Nickel sulfate, nickel chloride | P-03 |
| H3BO3 | pH, boric acid | P-07 | |
| Conductive processing | Cu | Copper | P-01 |
Flat-panel Display Market
| Process | Model | Managed components | Catalog no. |
|---|---|---|---|
| Cleaning | TMAH | Tetramethylammonium hydroxide | A-03 |
| NaOH | Sodium hydroxide | A-05 | |
| KOH | Potassium hydroxide | A-06 | |
| Development | Na2CO3 | pH, sodium carbonate | A-01 |
| TMAH | Tetramethylammonium hydroxide | A-03 | |
| NaOH | Sodium hydroxide | A-05 | |
| KOH | Potassium hydroxide | A-06 | |
| MEA | Monoethanolamine | A-04 | |
| TEA | Triethanolamine | A-22 | |
| Etching | Ce , HNO3 | Ceric nitrate, nitric acid | A-12 |
| C2H2O4 | Oxalic acid | A-10 | |
| H2PO4 , HNO3 , C2H4O2 | Phosphoric acid, nitric acid, acetic acid | A-11 | |
| Cr | Hexavalent chromium | A-25 | |
| Stripping | Na2CO3 | pH, sodium carbonate | A-01 |
| NaOH | Sodium hydroxide | A-05 | |
| KOH | Potassium hydroxide | A-06 | |
| MEA | Monoethanolamine | A-04 |
Plating Processing Market
| Process | Model | Managed components | Catalog no. |
|---|---|---|---|
| Electrolytic degreasing | NaOH | Sodium hydroxide | A-05 |
| Electroless copper plating | NaOH , HCHO , Cu | Sodium hydroxide, formalin, copper | P-01 |
| Electroless nickel plating | Ni | pH, nickel | P-02 |
| NaH2PO2 | Sodium hypophosphite | A-15 | |
| N2H4 | Hydrazine | A-23 | |
| Electro-nickel plating (sulfamic acid bath) | Ni | pH, nickel sulfamate | P-02 |
| H3BO3 | Boric acid | P-07 | |
| Electro-nickel plating (Watts bath) | Ni , Cl | Nickel sulfate, nickel chloride | P-03 |
| H3BO3 | pH, boric acid | P-07 | |
| Electro-copper plating (copper sulfate bath) | H2SO4 , Cu | Sulfuric acid, copper | P-04 |
| Cl | Chlorine | P-05 | |
| Fe3+ | Trivalent iron | A-21 | |
| Zinc plating (zincate bath) | Zn, NaOH | Zinc, sodium hydroxide | A-16 |
| Electro-alloy plating (black Ni-Zn) | Zn | Zinc | A-16 |
| Ni | pH, nickel | P-02 | |
| Electro-palladium plating | Pd | Palladium | P-06 |
